液冷电子设备的冷板流阻匹配研究

Research on Flow Resistance Matching Design of Liquid Cooling Cold Plate for Electronic Equipment

中文关键词: 液冷  流阻特性  匹配  热仿真

英文关键词: liquid cooling  flow resistance characteristic  matching  thermal simulation

中文摘要:

      液冷技术已广泛应用于高密度航空电子设备的冷却系统中，为了使航空电子设备的单机冷却系统工作在接近理论设计工况下，在设计上必须保证其中的散热器或冷板的流阻与载机环控系统设计的流阻分配值相匹配。文中介绍了某机载电子设备液冷冷板的流阻匹配设计过程，通过热流耦合仿真计算，择优选取了满足散热需求、同时流阻较小的方案。该方案很好地匹配了流阻指标要求，得到了试验验证。

英文摘要:

      Liquid cooling technology has been widely used in high density avionics cooling system. In order to make operating conditions for electronic apparatus stand-alone cooling system close to the theoretical design conditions, it must be ensured that the value of radiator or the flow resistance of the cold plate matches the value distributed by the aircraft environmental control system design. This paper introduces a flow resistance matching study of liquid cooling cold plate in airborne equipment. Corresponding to the cooling requirements and flow resistance suitable, a acceptable design is selected by heat-flux coupled simulation. The flow resistance characteristic is well-matched and verified by experiment.