功率芯片高导热导电胶接技术研究

Research on Die Attaching Technology of Power Amplifier Chip Using Adhesive with High Thermal and Electrical Conductivity

中文关键词: 功率芯片  高导热  胶接

英文关键词: power amplifier chip  high thermal conductivity  adhesive bonding

中文摘要:

      金锡焊料（20Sn/80Au）具有较高的导热率，常用于功率器件的焊接。但金锡焊料的焊接温度高，在焊接过程中常会导致砷化镓（GaAs）功率芯片损坏，因此文中选用了一种新型的高导热导电胶代替金锡焊料，将功率芯片粘接在热沉上，并进行相关工艺研究。与金锡焊料相比，高导热导电胶具有相同的散热能力，但生产操作温度可由300 ℃下降至200 ℃。文中还研究了高导热导电胶固化参数与胶透率的关系，以及环境试验对芯片剪切力的影响。结果表明，高导热导电胶可以代替金锡焊料，满足功率芯片的散热和连接可靠性要求。

英文摘要:

      Gold-tin (20Sn/80Au) eutectic is the interconnecting material for common power devices because of its high thermal conductivity, but the high operation temperature often damages GaAs power amplifier. So in this paper, a novel fabrication technique is used to bond a power amplifier to heat sink using the adhesive with high thermal and electrical conductivity. Compared to Au/Sn welding material (300 ℃), this kind of adhesive, with the same cooling effect as Au/Sn welding material, has lower operation temperature (200 ℃). The relationship between the void ratio and solidification parameter, the effect of environment test on the die shear strength are also studied. The results show that this adhesive bonding technique can be used in the manufacturing of power modules with high reliability.