VPX架构下高热流密度电子设备热设计

Thermal Design of High Heat Flux Electronic Equipmentunder VPX Framework

中文关键词: VPX模块  热设计  热仿真

英文关键词: VPX module  thermal design  thermal simulation

中文摘要:

      随着电子设备的国产化、小型化以及各种功能的进一步集成，其热流密度不断增大，对电子设备的热设计提出了更高的要求。文中基于VITA48.2定义的VPX模块进行电子设备整机热设计，提出了一种满足高热流密度VPX模块散热要求的整机结构形式，分析了该种散热结构的热阻网络，并通过6sigma软件进行了热仿真分析，根据仿真结果优化热设计方案，提高散热效率。文中的热设计方案及仿真结果可以为类似的风冷机箱热设计提供有效的参考。

英文摘要:

      With the localization and miniaturization of electronic equipment and the further integration of various functions, the heat flux density of electronic equipment is increasing, higher requirements for the thermal design of electronic equipment are put forward. The thermal design of electronic equipment is carried out based on the VPX module defined by VITA48.2 and an equipment structure satisfying the heat dissipation requirement of the high heat flux VPX module is proposed. The thermal resistance network of this kind of heat dissipation structure is analyzed and the thermal simulation analysis through 6sigma software is conducted. The thermal design scheme is optimized according to the simulation results, and the heat dissipation efficiency is improved. The thermal design scheme and simulation results in this paper can provide an effective reference for the thermal design of similar air-cooled chassis.