电子封装金属微凸点制备技术研究进展

Advances in Preparation Technology of Metal Micro-bumps for Electronic Packaging

中文关键词: 面积阵列封装  金属微凸点制备  球栅阵列封装  倒装芯片封装

英文关键词: area array packaging  metal micro-bump preparation  ball grid array packaging  flip chip packaging

中文摘要:

      起着电互连、热传递和机械支撑等重要作用的金属微凸点是基于面积阵列封装的关键。以球栅阵列封装（Ball Grid Array Packaging, BGA）、芯片尺度封装（Chip Scale Packaging, CSP）以及倒装芯片封装（Flip Chip Packaging, FCP）为代表的面积阵列封装形式凭借硅片利用率高、互连路径短、信号传输延时短以及寄生参数小等优点迅速成为当今中高端芯片封装领域的主流。然而，不同应用领域的微凸点具有尺寸跨度大、材料范围广的特点，很难有一种技术能实现全尺寸范围内不同材料金属微凸点的制备。文中综述了当前主流的微凸点制备技术，包括每种技术的优缺点及其适用范围、常见微凸点材料等，最后对当下微凸点制备技术的发展趋势进行了展望。

英文摘要:

      Metal micro-bumps, which play important roles in electrical interconnection, heat transfer and mechanical support, are the key to area array based packaging. Area array packaging, represented by ball grid array packaging (BGA), chip scale packaging (CSP) and flip chip packaging (FCP), has rapidly become the mainstream in the field of mid to high-end chip packaging due to its advantages such as high silicon wafer utilization rate, short interconnect paths, short signal transmission delay and small parasitic parameters. However, micro-bumps in different application fields have the characteristics of large size span and wide material range, which makes it difficult to have a technology that can achieve preparation of metal micro-bumps in different materials within the full size range. The current mainstream micro-bump preparation technologies are summarized in this paper, including the advantages & disadvantages of each technology and its application range, common micro-bump materials, etc. Finally, the development trend of current micro-bump preparation technologies is prospected.