复合蒸汽通道柔性均热板设计及其传热性能研究

Design of Flexible Vapor Chamber with Composite Vapor Channel and Study of Its Heat Transfer Performance

中文关键词: 柔性均热板  传热性能  复合蒸汽通道

英文关键词: flexible vapor chamber  heat transfer performance  composite vapor channel

中文摘要:

      近年来，随着科技的发展与进步，各种柔性电子设备得到普及。成倍增长的功耗导致电子芯片在狭小空间内产生过高的热流密度和工作温度，引发了严重的散热问题。然而，传统的均热板因较大的刚性不适用于柔性电子设备。为解决上述问题，文中基于铝塑膜壳体制造了一种具有复合蒸汽通道结构的厚2.2 mm的柔性均热板，并对其在不同灌液量、不同重力方向、不同弯折角度和弯折次数的稳态传热性能进行了测试。结果表明：该柔性均热板的最佳灌液量为700 μL；在7 W的加热功率下，其热导率最高可达1 264.9 W/(m·℃)，为壳体材料（铝塑膜）本身热导率的4 517.6倍，其传热性能良好。

英文摘要:

      In recent years, with the development and progress of science and technology, various flexible electronic devices have been popularized. The ensuing doubling of power consumption has led to excessive heat flux and work temperature of electronic chips in a small space, causing severe heat dissipation problems. However, conventional vapor chambers are not suitable for flexible electronic devices because of its high rigidity. In order to solve these problems, a 2.2 mm thick flexible vapor chamber with a composite vapor channel is fabricated based on an aluminum-plastic film shell in this paper. The steady-state heat transfer performances under different injection volume, different gravity directions, different bending angles and times are tested. The results show that the best injection volume of the flexible vapor chamber is 700 μL, and its maximum thermal conductivity is 1 264.9 W/(m•℃) under the heating power of 7 W, which is 4 517.6 times of that of the shell material (aluminum-plastic film) itself. The flexible vapor chamber has good heat transfer performance.