固态均热板外壳的典型设计参量影响分析

Influence Analysis of Typical Design Parameters in Solid Chamber Module Housing

中文关键词: 固态均热板  设计参量  导热系数  接触热阻  敏感度分析

英文关键词: solid chamber  design parameter  thermal conductivity  contact thermal resistance  sensitivity analysis

中文摘要:

      文中识别了固态均热板模块外壳的典型设计参量，并以一个高热耗模块为背景，开展了各典型设计参量对模块整体导热性能影响的研究。研究结果表明，外壳的整体导热性能与高导热层的平面导热系数、Z 向尺寸、固态均热板“三明治”结构的异种材料间水平接触热阻3个设计参量的关联较大，与高导热层垂直导热系数、X向尺寸、固态均热板“三明治”结构的异种材料间垂直接触热阻关联较小。此外，还对研究数据进行了敏感度分析。分析结果表明，高导热层的平面导热系数、Z 向尺寸与外壳整体的传热性能呈线性相关，“三明治”结构异种材料间的水平接触热阻与外壳整体的传热性能呈非线性相关。该研究成果为后续固态均热板壳体在材料、结构尺寸和“三明治”构型加工工艺的设计选型提供了依据。

英文摘要:

      In this paper the typical design parameters of solid chamber module housing is identified. The influence of typical design parameters on the overall thermal conductivity of the module housing is studied with a typical high heat consumption module as an example. The results show that the overall thermal conductivity of the module housing is closely related to the planar thermal conductivity of the high thermal conductivity layer, the Z-dimension and the horizontal contact thermal resistance of the sandwich composite materials, and less correlated to the vertical thermal conductivity of the high thermal conductivity layer, the X-dimension and the vertical contact thermal resistance of the sandwich composite materials. In addition, further sensitivity analysis is performed on the study data. The results show that the planar thermal conductivity and Z-dimension of the high thermal conductivity layer are linearly related to the overall heat transfer performance of the module housing, and the horizontal contact thermal resistance of the sandwich structure materials is nonlinear related to the overall heat transfer performance of the module housing. These research results provide a basis for the design of solid chamber module housing.