混合基板表面前处理工艺研究

A Study on the Process of Pre-treatment on Hybrid Substrate Surface

中文关键词: 厚薄膜  混合基板  离子束刻蚀  附着力

英文关键词: thick-thin film  hybrid substrate  ion beam etching  adhesion

中文摘要:

      基于氮化铝高温共烧陶瓷（High Temperature Co-fired Ceramics, HTCC）厚薄膜混合基板的结构特点和工艺流程，通过探究分析混合基板表面研磨抛光后的微观状态，文中揭示了抛光后基板表面富氮疏松层的存在及附着力下降的机理，研究和优化了氮化铝HTCC厚薄膜混合基板制造工艺，创新性地在前处理工艺中增加离子束刻蚀处理，从而有效消除了基板表面抛光引入的疏松层和表面残留的有机物污染，为表面薄膜布线提供了良好的界面。经过优化前处理工艺的基板表面导体附着力得到大幅提升，制作出的混合基板全部通过3M610附着力胶带考核，表面导体焊接拉脱附着力超过79.43 N，有效解决了混合基板工程化应用过程出现的导体膜层脱膜问题。

英文摘要:

      In this paper, based on the structural characteristics of aluminium nitride (AlN) high temperature co-fired ceramics (HTCC) thick-thin film hybrid substrate and its pre-treatment process, by examining the microstructure of hybrid substrate surface after grinding and polishing, it is discovered that a nitrogen-rich loose layer forms on the polished surface, leading to a reduction in adhesion. In this paper the manufacturing process of AlN HTCC thick-thin film hybrid substrates is further studied and optimized by innovatively incorporating an ion beam etching treatment in the pre-treatment process. This treatment effectively removes the loose layer introduced during polishing and eliminates residual organic contamination on the substrate surface, thereby providing a superior interface for the thin film circuit fabrication. After optimizing the pre-treatment process, the surface conductor adhesion of substrate is significantly improved. The fabricated hybrid substrates have successfully passed the test of the 3M610 tape, with surface conductor solder pull-off adhesion exceeding 79.43 N. This study effectively resolves the issue of delamination of surface conductor films observed during the engineering application of hybrid substrates.