基于子结构的SiP封装BGA跨尺度建模方法

Cross-scale Modeling Method for SiP Packaging BGA Based on Substructure

中文关键词: 子结构法  焊球  有限元分析

英文关键词: substructure method  solder ball  finite element analysis

中文摘要:

      文中针对封装结构中焊球模型与基板微通道等模型的跨尺度现象，设计了基于微通道散热技术实现的包含球形栅格阵列（Ball Grid Array, BGA）封装的系统级封装（System in Package, SiP）结构。BGA封装中的焊球尺寸小、数量多，使得封装结构在有限元建模时的跨尺度问题更为严重。文中生成焊球子结构，并通过算例对焊球子结构建模的准确性进行验证。结果表明：采用子结构方法得到的计算结果不仅与使用常规有限元建模方法得到的结果相差较小，并且还减少了计算时间，为封装结构仿真模型中跨尺度问题提供了方案。

英文摘要:

      Aiming at the cross-scale phenomenon between the solder ball model and the substrate microchannel model in the packaging structure, a system in package (SiP) structure including ball grid array (BGA) packaging based on microchannel heat dissipation technology is designed in this paper. The solder balls in the BGA packaging are small in size and large in number, which makes the cross-scale problem of the packaging structure more serious in finite element modeling. The solder ball substructure is generated and the accuracy of the solder ball substructure model is verified by examples in this paper. The results show that when adopting the substructure method, the calculation results are not much different from those obtained by the conventional finite element modeling method, and the calculation time is reduced, which provides a solution to the cross-scale problem in the simulation model of the packaging structure.